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Polymer Property : Thermal Conductivity = 0.810 W/m-K Product List

Thermal Properties

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Thermal Properties Metric English Comments
Thermal Conductivity 0.810 W/m-K

@Temperature 80.0 °C
5.62 BTU-in/hr-ft²-°F

@Temperature 176 °F
ASTM C518
Rogers Corporation RO3210 Woven-Glass Reinforced PTFE Laminate
Features and Benefits:Woven glass reinforcement - Improves rigidity for easier handlingUniform electrical and mechanical performance - ideal for complex multi-layer high frequency structuresLow diel..
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Torlon® 4435 Polyamide-imide (PAI)  (Unverified Data**)
Torlon 4435 is a polyamide-imide resin specifically designed to provide exceptionally low wear performance in non-lubricated applications even at high pressure and velocity (PV) conditions. Not only..
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-KZFS11 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-LASF40 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-LASF43 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-SSK2 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
ASTM C177
Solvay Specialty Polymers Torlon® 4435 Polyamide-imide (PAI)
Torlon® 4435 is a polyamide-imide resin specifically designed to provide exceptionally low wear performance in non-lubricated applications even at high pressure and velocity (PV) conditions. Not ..
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-KZFS2 Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Schott N-LAK33A Glass
Information Provided by SCHOTT North America, Inc.
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
ASTM C-518
Sumitomo Bakelite North America SI 9002N-1 Silicone Compound
Short fibergass reinforced silicone molding compound which offers moderate strength properties, dimensional stability, and excellent long-term thermal stability at elevated temperatures.Information ..
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
Loctite® 3151 1 component acrylic UV/Heat Cure Acrylic Adhesive
Thermally Conductive BondersLoctite® Thermally Conductive Adhesives eliminate the need for mechanical fasteners and clips, while providing the most efficient thermal transfer between transistors or..
Thermal Conductivity 0.810 W/m-K

@Temperature 121 °C
5.62 BTU-in/hr-ft²-°F

@Temperature 250 °F
Tra-Con Tra-Bond 161-3 Temperature Resistant Epoxy Adhesive
TRA-BOND 161-3 two component, premixed and frozen, epoxy adhesive is highly filled. This electrically insulating adhesive provides structural strength to 150°C and semi structural strength to 300°..
Thermal Conductivity 0.810 W/m-K
5.62 BTU-in/hr-ft²-°F
ASTM E1461
Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moist..
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