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Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards
| Category | Polymer , Thermoplastic , Fluoropolymer , PTFE |
| Manufacturer | Arlon |
| Trade Name | |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Arlon AD1000 PTFE/Woven Fiberglass/Ceramic Filled Laminate for Microwave Printed Circuit Boards.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Only Woven Glass Reinforced PTFE/Ceramic with Dk of 10.2 or greaterHigh Copper Peel Strength allows for thinner etched line widthsLowest insertion loss availableLarger Panel sizes availableLow moisture absorptionExcellent CTE values lead to high reliability ceramic component attachment and PTH reliabilityBenefits:Mechanically strongGreater dimensional stability than other 10 Dk productsCircuit miniaturizations leads to weight savingsHeat Dissipation and ManagementGreater signal integrityCost-effective board layout and board processingLow loss in humid environmentsTypical Applications:Ideal for X-band and belowRadar modules and manifoldsAircraft Collision Avoidance Systems (TCAS)Ground Based Radar Surveillance SystemsMiniaturized Circuitry & Patch AntennasPower Amplifiers (PAs)Low Noise Amplifiers (LNAs)This data represents typical values for the production material and should not be used as material specifications.Information provided by ARLON Silicone Technologies Division.
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 3.20 g/cc | 0.116 lb/in³ | ASTM D792 Method A |
| Water Absorption | 0.030 % | 0.030 % | IPC TM-650 2.6.2.1 |
| Outgassing - Total Mass Loss | 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Collected Volatiles; NASA SP-R-0022A |
| 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Water Vapor Recovered; NASA SP-R-0022A | |
| 0.010 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.010 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
NASA SP-R-0022A |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength | 29.6 MPa | 4300 psi | Cross; IPC TM-650 2.4.18.3 |
| 35.2 MPa | 5100 psi | Machine; IPC TM-650 2.4.18.3 | |
| Modulus of Elasticity | 1.38 GPa | 200 ksi | IPC TM-650 2.4.18.3 |
| Flexural Strength | 51.7 MPa | 7500 psi | Cross; IPC TM-650 2.4.4 |
| 68.3 MPa | 9900 psi | Machine; IPC TM-650 2.4.4 | |
| Compressive Modulus | >= 2.93 GPa | >= 425 ksi | ASTM D3410 |
| Poissons Ratio | 0.16 | 0.16 | ASTM D3039 |
| Peel Strength | >= 2.10 kN/m | >= 12.0 pli | To Copper (1 oz./35 micron); After Thermal Stress; IPC TM-650 2.4.8 |
| 2.38 kN/m | 13.6 pli | To Copper (1 oz./35 micron); At Elevated Temperatures; IPC TM-650 2.4.8.2 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 8.00 - 10.0 µm/m-°C @Temperature 50.0 - 150 °C |
4.44 - 5.56 µin/in-°F @Temperature 122 - 302 °F |
IPC TM-650 2.4.41 |
| CTE, linear, Transverse to Flow | 20.0 µm/m-°C @Temperature 50.0 - 150 °C |
11.1 µin/in-°F @Temperature 122 - 302 °F |
z direction; IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.810 W/m-K | 5.62 BTU-in/hr-ft²-°F | ASTM E1461 |
| Decomposition Temperature | >= 500 °C | >= 932 °F | 5 percent; IPC TM-650 2.4.24.6 |
| >= 500 °C | >= 932 °F | Onset; IPC TM-650 2.4.24.6 | |
| Flammability, UL94 | V-0 | V-0 |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 5.36e+13 ohm-cm | 5.36e+13 ohm-cm | E24/125; IPC TM-650 2.5.17.1 |
| 1.40e+15 ohm-cm | 1.40e+15 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 | |
| Surface Resistance | 3.16e+14 ohm | 3.16e+14 ohm | E24/125; IPC TM-650 2.5.17.1 |
| 1.80e+15 ohm | 1.80e+15 ohm | C96/35/90; IPC TM-650 2.5.17.1 | |
| Dielectric Constant | 10.2 @Frequency 1.00e+10 Hz |
10.2 @Frequency 1.00e+10 Hz |
may vary by thickness; IPC TM-650 2.5.5.5 |
| Dielectric Strength | 24.5 kV/mm | 622 kV/in | IPC TM-650 2.5.6.2 |
| Dielectric Breakdown | >= 45000 V | >= 45000 V | IPC TM-650 2.5.6 |
| Dissipation Factor | 0.0023 @Frequency 1.00e+10 Hz |
0.0023 @Frequency 1.00e+10 Hz |
may vary by thickness; IPC TM-650 2.5.5.5 |
| Arc Resistance | >= 180 sec | >= 180 sec | IPC TM-650 2.5.1 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| IPC Delamination - T260 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| IPC Delamination - T288 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| IPC Delamination - T300 (minutes) | > 60 | IPC TM-650 2.4.24.1 |
| Temperature Coefficient of Dielectric (ppm/°C) | -380 | IPC TM-650 2.5.5.5; at 10 GHz (-40 - 150°C) |
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