Polymer Property : Thermal Conductivity = 0.720 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Thermal Conductivity	0.720 W/m-K @Temperature 80.0 °C	5.00 BTU-in/hr-ft²-°F @Temperature 176 °F	ASTM C518
Rogers Corporation TMM® TMM6 Ceramic Thermoset Polymer Composite TMM® Thermoset microwave materials are ceramic thermoset polymer composites designed for high plate-thru-hole reliability stripline and microstrip applications. The electrical and mechanical prope..
Thermal Conductivity	0.720 W/m-K	5.00 BTU-in/hr-ftÂ²-Â°F	ASTM F433
Saint-Gobain MeldinÂ® 7021 CM Compression Molded Graphite Filled Polyimide MelidinÂ® 7021 CM is a self-lubricating compression molded polyimide that contains 15% graphite filler. MelidinÂ® 7021 has a low coefficient of friction and high heat resistance, and is best fo..
Thermal Conductivity	0.720 W/m-K	5.00 BTU-in/hr-ftÂ²-Â°F	ASTM C-518
Sumitomo Bakelite North America E 8940SG Electrical Encapsulation Grade Epoxy Mineral reinforced epoxy molding compound formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. USES: Passive electron..
Thermal Conductivity	0.720 - 0.865 W/m-K	5.00 - 6.00 BTU-in/hr-ft²-°F
Master Bond Mastersil 726 Conductive Silicone Compound for Heat Transfer Master Bond Polymer System MasterSil 726 is a non-curing grease-like thermally conductive silicone compound. It is extremely stable, it will not dry out, cure, harden, or bleed, even after exposure ..
Thermal Conductivity	0.720 W/m-K @Temperature 100 °C	5.00 BTU-in/hr-ft²-°F @Temperature 212 °F	ASTM E1461
Plenco 1530 Polyester, Briquette, Injection Molded PLENCO 01530 is a glass and mineral reinforced pelletized polyester molding compound, offering improved mechanical strength properties along with excellent electrical properties and dimensional stab..
Thermal Conductivity	>= 0.720 W/m-K	>= 5.00 BTU-in/hr-ft²-°F
Master Bond EP30LTE-LO Dimensionally Stable Low Outgassing Two Part Epoxy Master Bond Polymer System EP30LTE-LO is a thermal shock resistant epoxy resin system with low thermal expansion properties and dimensional stability for high performance bonding, sealing and castin..
Thermal Conductivity	0.720 W/m-K	5.00 BTU-in/hr-ft²-°F	ASTM C-177
Technetics Group Texolon™ 8534 PTFE (Unverified Data**) PTFE CharacteristicsChemical ResistanceThermal StabilityCryogenic PropertiesLow Coefficient of FrictionLow Surface EnergyLow Dielectric ConstantHigh Volume and Surface ResistivityFlame ResistanceApp..
Thermal Conductivity	0.720 W/m-K	5.00 BTU-in/hr-ft²-°F
Ceradyne Thermo-Sil® Castable 220 Fused Silica Fused Silica is an excellent thermal insulator with an extremely low coefficient of thermal expansion. It is excellent for thermal shock applications. The key characteristics of this material are:Hi..