Polymer Property : Thermal Conductivity = 0.399 W/m-K Product List

Thermal Properties

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Thermal Properties	Metric	English
Thermal Conductivity	0.399 W/m-K	2.77 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 2214 Hi-Dense Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Hi-Dense is a deareted version of Scotch-Weld adhesive 2214 regular for use where a very dense, void free bondline is required. One part 250°F (121°C) curing 100% ..
Thermal Conductivity	0.399 W/m-K	2.77 BTU-in/hr-ft²-°F
3M Scotch-Weld™ 2214 Regular Epoxy Adhesive 3M™ Scotch-Weld™ Adhesive 2214 Regular is an aluminum filled general purpose product for use in applications where high strength bonds are needed in a temperature range of -53-121°C.One part 250°..