Polymer Property : CTE, linear = 68.9 µin/in-°F Product List

Thermal Properties

Tips: 30 items are displayed at most. For the rest of the results, please contact customer service.

Thermal Properties	Metric	English	Comments
CTE, linear	124 - 124 µm/m-°C @Temperature 60.0 - 138 °C	68.9 - 68.9 µin/in-°F @Temperature 140 - 280 °F	Average value: 124 µm/m-°C Grade Count:1
Overview of materials for Polybutylene Terephthalate (PBT), Flame Retardant This property data is a summary of similar materials in the MatWeb database for the category "Polybutylene Terephthalate (PBT), Flame Retardant". Each property range of values reported is minimum an..
CTE, linear	124 Âµm/m-Â°C @Temperature 20.0 Â°C	68.9 Âµin/in-Â°F @Temperature 68.0 Â°F	ASTM E831
Spartech Royalite R60M Hi-Impact ABS/PVC Resin Data provided by the manufacturer. This rigid, fire-rated, proprietary resin is specifically formulated to meet the requirements of the FAR 25.853 A flammability test. Primary applications are air..
CTE, linear	124 µm/m-°C	68.9 µin/in-°F
Dow Corning SE 4486 SILICONE RTV One-part, white, moisture cure RTV, highly flowable, fast tack-free, high thermal conductivity, controlled volatility.Information provided by Dow Corning
CTE, linear	124 µm/m-°C	68.9 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
CTE, linear	124 µm/m-°C	68.9 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..