Polymer Property : CTE, linear = 25.9 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	25.9 µm/m-°C @Temperature 21.1 °C	14.4 µin/in-°F @Temperature 70.0 °F
Parkway Products Thixomolded® AM50A Magnesium Thixomolding® is a fabrication technique, similar to injection molding, that uses magnesium alloys as the “resin” instead of plastic. Solid magnesium alloy pellets are fed into the machine, heate..
CTE, linear	25.9 µm/m-°C	14.4 µin/in-°F
Atom Adhesives AA-BOND 2156 Epoxy Adhesive AA-BOND 2156 is a thixotropic (smooth paste) thermally conductive epoxy system. It is used for staking heat sinks, transistors, diodes, resistor, integrated circuits and other heat-sensitive compone..
CTE, linear	25.9 µm/m-°C	14.4 µin/in-°F
Atom Adhesives AA-SUPERTHERM 05 Epoxy Adhesive AA-SUPERTHERM 05 is a thixotropic (smooth paste) Pure Diamond ultra-high thermally conductive epoxy two-part adhesive that develops strong, durable, high-impact bonds at room temperature which impro..
CTE, linear	25.9 µm/m-°C @Temperature 20.0 °C	14.4 µin/in-°F @Temperature 68.0 °F	ASTM D696
PolyOne Edgetek® ES-20GF/000 Polyethersulfone, Glass Filled (discontinued **) Description/Features:Glass Fiber ReinforcedInformation provided by PolyOne Corporation.