Polymer Property : CTE, linear = 181 µm/m-°C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
CTE, linear	181 µm/m-°C	101 µin/in-°F	Above Tg
Epoxy Technology EPO-TEK® ED1020 Epoxy Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include exce..
CTE, linear	181 µm/m-°C @Temperature 40.0 - 140 °C	101 µin/in-°F @Temperature 104 - 284 °F
3M Scotch-Weld™ DP-105 Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP105 Clear is a fast setting, very flexible 1:1 mix ratio epoxy adhesive/sealant. Its flexibility when cured makes it ideal for applications involving dissimilar s..
CTE, linear	181 µm/m-°C @Temperature >=20.0 °C	101 µin/in-°F @Temperature >=68.0 °F	above Tg
Resinlab® EP1026R Rubber Modified Epoxy Adhesive Resinlab™ EP1026R is a two part unfilled rubber modified epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free ..