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Epoxy Technology EPO-TEK® ED1020 Epoxy
| Category | Polymer , Thermoset , Epoxy |
| Manufacturer | Epoxy Technology |
| Trade Name | EPO-TEK® |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Epoxy Technology EPO-TEK® ED1020 Epoxy.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Preliminary Product Information SheetMaterial Description: A single component, silver-filled epoxy designed for low power semiconductor LED die attach applications. Its unique features include excellent adhesion and stress relief through mechanical reliability testing. Other attributes include long pot-life, low viscosity and high thixotropy making it ideal for a wide range of application methods including wafer level stamping and syringe dispensing.Information Provided by Epoxy Technology
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | 2.89 g/cc | 2.89 g/cc | |
| Particle Size | <= 20 µm | <= 20 µm | |
| Viscosity | 1479 cP @Temperature 23.0 °C |
1479 cP @Temperature 73.4 °F |
100 rpm |
| 9569 cP @Temperature 23.0 °C |
9569 cP @Temperature 73.4 °F |
10 rpm | |
| 28583 cP @Temperature 23.0 °C |
28583 cP @Temperature 73.4 °F |
1 rpm |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Hardness, Shore D | 40 | 40 | |
| Tensile Modulus | 0.24892 GPa | 36.103 ksi | Storage |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 45.0 µm/m-°C | 25.0 µin/in-°F | Below Tg |
| 181 µm/m-°C | 101 µin/in-°F | Above Tg | |
| Thermal Conductivity | 1.88 W/m-K | 13.0 BTU-in/hr-ft²-°F | |
| Maximum Service Temperature, Air | 150 °C | 302 °F | Continuous |
| 250 °C | 482 °F | Intermittent | |
| Minimum Service Temperature, Air | -55.0 °C | -67.0 °F | Continuous |
| -55.0 °C | -67.0 °F | Intermittent | |
| Glass Transition Temp, Tg | >= 46.0 °C | >= 115 °F | Dynamic Cure 20—200°C /ISO 25 Min; Ramp -10—200°C @ 20°C/Min |
| Decomposition Temperature | 333 °C | 631 °F | Degradation Temperature |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | <= 0.00040 ohm-cm | <= 0.00040 ohm-cm |
| Chemical Properties | Metric | English | Comments |
|---|---|---|---|
| Ionic Impurities - Na (Sodium) | 0.00 ppm | 0.00 ppm | |
| Ionic Impurities - K (Potassium) | 4.0 ppm | 4.0 ppm | |
| Ionic Impurities - Cl (Chloride) | 169 ppm | 169 ppm |
| Processing Properties | Metric | English | Comments |
|---|---|---|---|
| Cure Time | 60.0 min @Temperature 150 °C |
1.00 hour @Temperature 302 °F |
|
| Pot Life | 40320 min | 40320 min | |
| Shelf Life | 12.0 Month @Temperature -40.0 °C |
12.0 Month @Temperature -40.0 °F |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Consistency | Smooth thixotropic paste | |
| Die Shear | 15.4 kg | Initial |
| 9.3 kg | After 1000hrs 85°C/85% RH | |
| Ionic Impurities NH4 | 67 ppm | |
| Number of Components | Single | |
| Thixotropic Index | 3 | |
| Weight Loss | 0.68% | 200°C |
| 1.24% | 250°C | |
| 1.71% | 300°C |
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