Thermal Properties | Metric | English | Comments |
---|---|---|---|
Decomposition Temperature | 483 °C | 901 °F | TGA, Degradation Temp, uncured |
Atom Adhesives AA-BOND G298 Epoxy Adhesive AA-BOND G298 is a two component, gold-filled, electrically and thermally conductive epoxy designed for hybrid microelectronic and semiconductor packaging.Appearance: Resin: Brown, Hardener: Dark Bro.. |