Polymer Property : Decomposition Temperature = 813 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	434 °C	813 °F	Degradation Temperature
Epoxy Technology EPO-TEK® 431 Copper Filled Epoxy A two component, copper-filled, electrically and thermally conductive epoxy for adhesive bonding in electronics. It may be used at the PCB level for interconnecting, grounding and EMI RF shielding...