Polymer Property : Decomposition Temperature = 802 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	428 °C	802 °F	Degradation Temperature; TGA
Epoxy Technology EPO-TEK® E2001 Electrically Conductive, Silver-Filled Epoxy Product Description: EPO-TEK® E2001 is a two component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications using a snap-cure profile. Advantages & Appl..
Decomposition Temperature	428 °C	802 °F	Degradation Temperature; TGA
Epoxy Technology EPO-TEK® E3001 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E3001-HV is a snap cure, single component, silver-filled die attach adhesive for semiconductor plastic IC packaging. Also available in a frozen syringe. Advantages & ..