Polymer Property : Decomposition Temperature = 754 °F Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	401 °C	754 °F	Degradation Temperature
Epoxy Technology EPO-TEK® 310M-T Flexible Epoxy Material Description: A two component, flexible epoxy designed for low stress applications in semiconductor, hybrid, medical, acoustical and optical industries. Replacement for EPO-TEK® 310T.Info..
Decomposition Temperature	401 °C	754 °F	Degradation Temperature; TGA
Epoxy Technology EPO-TEK® E2101 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® E2101 is a two component, thixotropic, electrically conductive adhesive. It may be used for circuit assembly and semiconductor applications. Advantages & Application ..