Polymer Property : Decomposition Temperature = 456 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	456 °C	853 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H31D-LV Epoxy Material Description: A single component, silver-filled, electrically conductive epoxy designed for semiconductor die attach applications found in hybrids, JEDEC, and optoelectronic packaging. It i..
Decomposition Temperature	456 °C	853 °F	Degradation Temperature
Epoxy Technology EPO-TEK® OE101 Two Component Epoxy Material Description: A two component epoxy designed for low stress applications in fiber optic packaging, opto-electronics and semiconductors. It is a lower modulus version of EPO-TEK® 353ND.Inf..