Polymer Property : Decomposition Temperature = 413 °C Product List

Thermal Properties

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Thermal Properties	Metric	English	Comments
Decomposition Temperature	413 °C	775 °F	Degradation Temperature
Epoxy Technology EPO-TEK® 323LP Epoxy Material Description: Longer pot life version of EPO-TEK® 353ND designed for semiconductor, hybrid, fiber-optic, hard-disk drive and medical applications.Information Provided by Epoxy Technology
Decomposition Temperature	413 °C	775 °F	Degradation Temperature
Epoxy Technology EPO-TEK® H27D Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H27D is a two component, silver-filled epoxy adhesive designed for semiconductor and hybrid-microelectronic packaging applications.Advantages & Application Notes: Rheo..