Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear | 76.0 µm/m-°C @Thickness 0.102 mm, Temperature 0.000 - 150 °C |
42.2 µin/in-°F @Thickness 0.00400 in, Temperature 32.0 - 302 °F |
Z-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation Syron™ 7100 Thermoplastic Circuit Material SYRON™ 7100 thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. SYRON 7100 is thermally stable, with a .. |
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CTE, linear | 76.0 µm/m-°C @Temperature 0.000 - 150 °C |
42.2 µin/in-°F @Temperature 32.0 - 302 °F |
Z-Direction; IPC-TM-650 2.1.41 |
Rogers Corporation XT/duroid™ 8100 0.004" Woven Glass Reinforced Thermoplastic Circuit Material XT/duroid™ 8100 woven glass reinforced thermoplastic circuit materials provide an excellent solution for printed circuit board applications used in demanding environmental conditions. XT/duroid 81.. |