Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Transverse to Flow | 55.5 µm/m-°C @Temperature 20.0 °C |
30.8 µin/in-°F @Temperature 68.0 °F |
|
Cookson Group Plaskon® 150.401 Encapsulation Resin
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade .. |