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Cookson Group Plaskon® 150.401 Encapsulation Resin  (discontinued **)

Category Polymer , Thermoset , Epoxy , Epoxy Encapsulant, Unreinforced
Manufacturer
Trade Name
Port Ningbo port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Cookson Group Plaskon® 150.401 Encapsulation Resin  (discontinued **).pdf
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Material Notes:
Test specimens were transfer molded and post cured 4 hours at 175°C.A second generation SMT-B family product. This material is the initial developmental, general purpose SMT-B encapsulation grade resin and has good adhesion to solder resist with no plasma or UV/Ozone cleaning for PBGA applications.
Physical Properties Metric English Comments
Density 1.90 g/cc
0.0686 lb/in³
Viscosity 8200 cP

@Temperature 175 °C
8200 cP

@Temperature 347 °F
Shimadzu Viscosity, 1000 psi
Spiral Flow 74.0 cm
29.1 in
175°C/1000 psi
Mechanical Properties Metric English Comments
Hardness, Shore D 88
88
Flexural Strength 76.0 MPa
11000 psi
Flexural Modulus 18.0 GPa
2610 ksi
Thermal Properties Metric English Comments
CTE, linear 15.5 µm/m-°C

@Temperature 20.0 °C
8.61 µin/in-°F

@Temperature 68.0 °F
CTE, linear, Transverse to Flow 55.5 µm/m-°C

@Temperature 20.0 °C
30.8 µin/in-°F

@Temperature 68.0 °F
Thermal Conductivity 0.700 W/m-K
4.86 BTU-in/hr-ft²-°F
Glass Transition Temp, Tg 220 °C
428 °F
Flammability, UL94 V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
V-0

@Thickness 3.20 mm
V-0

@Thickness 0.126 in
Electrical Properties Metric English Comments
Electrical Resistivity 4.70e+16 ohm-cm
4.70e+16 ohm-cm
Dielectric Constant 3.6

@Frequency 1000 Hz
3.6

@Frequency 1000 Hz
Dissipation Factor 0.0020

@Frequency 1000 Hz
0.0020

@Frequency 1000 Hz
Processing Properties Metric English Comments
Processing Temperature 170 - 185 °C
338 - 365 °F
Molding temperature
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