Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Transverse to Flow | 246 µm/m-°C | 137 µin/in-°F | z, above Tg; IPC TM-650 2.4.24 |
Arlon 49N Multifunctional Epoxy Low-Flow Prepreg 49N is a low-flow epoxy prepreg engineered for bonding multilayer epoxy rigid-flex or attaching heat sinks to multilayer PCBs. With a high Tg, the prepreg can be used in high-performance or high-te.. |
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CTE, linear, Transverse to Flow | 246 µm/m-°C @Temperature 0.000 - 100 °C |
137 µin/in-°F @Temperature 32.0 - 212 °F |
z direction; IPC TM-650 2.4.24 |
Arlon CuClad 217 PTFE/Woven Fiberglass Laminate Microwave Printed Circuit Board Substrate CuClad 217 uses a low fiberglass/PTFE ratio to provide the lowest dielectric constant and dissipation factor available in fiberglass reinforced PTFE based laminates. Together, these properties offe.. |