Thermal Properties | Metric | English | Comments |
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Glass Transition Temp, Tg | 27.0 °C | 80.6 °F | TM R050-25 |
Resinlab® EP1121 Clear Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Clear is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |
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Glass Transition Temp, Tg | 27.0 °C | 80.6 °F | TM R050-25 |
Resinlab® EP1295 Black Medium Viscosity, Halogen Free, Flame Retardant Epoxy Casting Resin Resinlab™ EP1295 Black is a medium viscosity, halogen free, flame retardant epoxy casting resin system. It is recognized under the Component Recognition Program of Underwriters Laboratories Inc., (.. |
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Glass Transition Temp, Tg | 27.0 °C | 80.6 °F | Mid-Point |
3M Scotch-Weld™ DP190 Translucent Epoxy Adhesive 3M™ Scotch-Weld™ Epoxy Adhesive DP190 Translucent is a 1:1 mix ratio similar to Scotch-Weld™ Epoxy Adhesive 2216 B/A Translucent but faster curing.Information provided by 3M |
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Glass Transition Temp, Tg | 27.0 °C | 80.6 °F | TM R050-25 |
Resinlab® EP1200LV Casting Resin Resinlab™ EP1200LV a low viscosity version of EP1200, a highly filled, medium viscosity black casting resin designed for applications requiring a high degree of thermal conductivity, flexibility an.. |
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Glass Transition Temp, Tg | 27.0 °C | 80.6 °F | TM R050-25 |
Resinlab® EP1121 Black Electronic Grade Epoxy Encapsulant Resinlab™ EP1121 Black is a two part unfilled electronic grade epoxy encapsulant designed for small to medium sized castings. It cures completely at room temperature to a tough, flexible polymer. I.. |