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Polymer Property : Melting Point = 331 °F Product List

Thermal Properties

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Thermal Properties Metric English Comments
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Celcon® GB10 POM, 10% Glass Reinforced  (Unverified Data**)
Celcon® GB10 is a 10% glass bead filled grade for low shrinkage and warp resistance in large, flat, and thin walled parts.10% glass bead, low warpage, has been replaced by Hostaform® C 9021 GV3/10..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Celcon® MR50B POM, Specialty  (Unverified Data**)
Celcon® MR50B is a specialty media resistant grade developed for improved bleach resistance and improved toughness.Improved media resistance, improved toughnessStandard reciprocating screw injectio..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® C 9021 GV1/30 GT POM, 26% Tribological  (Unverified Data**)
Chemical abbreviation according to ISO 1043-1: POM26% glass fiber reinforced, specialty low wear grade based on UHMWPEInformation provided by Celanese
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® C 9021 SW XAP² ™ LS POM, Tribological  (Unverified Data**)
POM copolymerTribological, Low EmissionInformation provided by Celanese
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® EC140XF POM, Specialty  (Unverified Data**)
Hostaform® EC140XF is a conductive ESD grade of acetal copolymer for applications requiring dissipation of static build-up. EC140XF has an improved resistance to aggressive fuel blends.electrosta..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® EC270TX POM, Specialty  (Unverified Data**)
Hostaform® LW15EWX is a specialty low wear grade of acetal copolymer designed for improved performance including when paired against other thermoplastic resins (PBT, PA, PC, PMMA) or steel. Due to ..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® MT8F01 POM, Medical Technology  (Unverified Data**)
Hostaform® acetal copolymer grade MT8F01 is a special grade developed for medical industry applications containing low residual monomers. Hostaform® MT8F01 is a standard flow low level polytetrafl..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® MT8R02 POM, Medical Technology  (Unverified Data**)
Hostaform® acetal copolymer grade MT8R02 is a special grade developed for medical industry applications containing low residual monomers. Hostaform® MT8R02 is an improved wear performance grade t..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® MT8U01 POM, Medical Technology  (Unverified Data**)
Hostaform® acetal copolymer grade MT8U01 is a special grade developed for medical industry applications containing low residual monomers and no animal products. Hostaform® MT8U01 is an injection m..
Melting Point 166 °C
331 °F
ASTM D1525
Kolon Kocetal® EC701 Modified Grade Acetal Copolymer  (discontinued **)
Thermal properties: Kocetal has excellent heat stability; heat degradation is little under long term and high temperature application, compared to other POM. Maximum applicable temperature of produ..
Melting Point 166 °C
331 °F
ASTM D1525
Kolon Kocetal® VT701 Modified Grade Acetal Copolymer  (discontinued **)
Thermal properties: Kocetal has excellent heat stability; heat degradation is little under long term and high temperature application, compared to other POM. Maximum applicable temperature of produ..
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® CF704 Conductive Grade Acetal Resin
Carbon fiber added, high stiffness and conductive grade. Applications: Conductive products. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® GF702 G/F Reinforced Acetal Resin
Glass fiber reinforced, improved stiffness. Applications: Products for high stiffness, improved fatigue properties. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® LF302 Wear Modified Acetal Resin
Improved wear property and dimensional stability. Applications: Products for low noise and precision gear. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® TF302 Wear Modified Acetal Resin
PTFE powder added, improved wear property. Applications: High speed, high load and wear resistant products. Information provided by API-Kolon.
Melting Point 166 °C
331 °F
ASTM D1525
Kolon KOCETAL® UR302 Toughened Grade Acetal Resin
TPU added, improved toughness. Applications: Impact resistant, flexible products. Information provided by API-Kolon
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1/-3
Barlog Plastics KEBAFORM C 90.0 POM Copolymer unreinforced
POMInformation provided by BARLOG plastics GmbH.
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Celcon® GC15 POM, 15% Glass Reinforced
Celcon« GC15 is an acetal copolymer grade utilizing a nominal 15 wt. % fiber glass level to increase stiffness and strength.Information provided by Celanese
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Celcon® M90SW POM, Tribological
Celcon M90SW is a low wear grade designed for gears and other low wear applications, especially where reducing noise and wear against the same mating surface is important. This grade may be preferre..
Melting Point 166 °C
331 °F
DIN 53765
BASF Ultraform® W2320 U035 LEV POM
Description: Is a POM, UV-stabilized, very free-flowing, rapidly solidifying grade for injection molding, with reduced emission potential.Information provided by BASF
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® C 9021 10/9005 POM, Unfilled
Hostaform« C 9021 10/9005 is a nominal 9 melt flow rate acetal copolymer which is capable of being permanently marked by a laser. Parts molded from Hostaform« C 9021 10/9005 can be laser marked wi..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® C 9021 XAP2 LS POM, UV Resistant
POM copolymerInformation provided by Celanese
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® EC140XF POM, Specialty
Hostaform« EC140XF is a conductive ESD grade of acetal copolymer for applications requiring dissipation of static build-up. EC140XF has an improved resistance to aggressive fuel blends.Informatio..
Melting Point 166 °C
331 °F
ISO 11357-1,-2,-3
Celanese Hostaform® LX90Z XAP2 ™ POM, UV Resistant
Preliminary Data SheetDrying is required for this material to prevent poor appearance and performance of the part.Information provided by Celanese Corporation.
Melting Point 166 °C
331 °F
ISO 3146
Azdel Plus R301B01N 30% Continuous Random Fiber Mat / PP Resin Matrix
AZDEL® R301B01N is a random oriented needled continuous glass fiber mat material. This polypropylene composite material features high properties and a basic homogeneous fiber distribution. This m..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Celcon® LW90-S2 POM, Tribological
Celcon« LW90-S2 is a preblended low wear formulation of M90 base polymer containing 2% silicone. This standard low friction, low wear product performs well in many applications including those inv..
Melting Point 166 °C
331 °F
ASTM D789
Chem Polymer Formax 630 Acetal, High Flow
A 30 melt flow index copolymer acetal for use in products requiring extreme demands on processing characteristics but only moderate demands on mechanical performance.Data provided by the manufacture..
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® S 27063 POM, Impact Modified  (Unverified Data**)
Chemical abbreviation according to ISO 1043-1: POM-HI,Easy flowing elastomer-containing injection molding grade, moderate toughnessInformation provided by Celanese
Melting Point 166 °C
331 °F
10°C/min; ISO 11357-1,-2,-3
Celanese Hostaform® S 9363 XAP² ™ POM, Impact Modified  (Unverified Data**)
Hostaform® acetal copolymer grade S 9363 XAP2 ™ is an impact modified grade for demanding applications. Hostaform® S 9363 XAP2 ™ provides good impact strength while improving modulus and weld..
Melting Point 166 °C
331 °F
10K/min; ISO 3146
CENTROPLAST CENTRODAL TF Polyoxymethylene + PTFE
This material is high strength and high heat strength dimensional stability. Applications include racks and annular gears, dimensionally accurate structural components for pumps, and housings and t..
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