Mechanical Properties | Metric | English | Comments |
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Tensile Modulus | 4.33 GPa | 628 ksi | Storage |
Epoxy Technology EPO-TEK® H20E-175 Electrically Conductive, Silver Epoxy Product Description: EPO-TEK® H20E-175 is a two component epoxy designed for semiconductor die-attach. It is a higher Tg version of EPO-TEK® H20E. It was designed to be used in semiconductor / J.. |
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Tensile Modulus | 4.33 GPa | 628 ksi | 1mm/min; ISO 527 |
BASF Ultramid® HPN 9362 40% Mineral Filled PA6 (Dry) Ultramid HPN 9362 is a 40% mineral reinforced, impact modified nylon 6 injection molding compound. It is one of the High Productivity Nylon series having improved surface appearance while reducing c.. |