Polymer Property : Compressive Modulus = 225 ksi Product List

Mechanical Properties

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Mechanical Properties	Metric	English	Comments
Compressive Modulus	1.55 GPa	225 ksi	ASTM D695
Quadrant EPP Fluorosint® 207 PTFE, Compression Molded Synthetic Mica-filled PTFE (ASTM Product Data Sheet)
Compressive Modulus	1.55 GPa	225 ksi	ASTM D3410
Arlon CLTE Microwave Printed Circuit Board Substrate CLTE is a ceramic powder-filled and woven micro fiberglass reinforced PTFE composite engineered to produce a stable, low water absorption laminate with a nominal Dielectric Constant of 2.98.Ceramic/..
Compressive Modulus	1.55 GPa	225 ksi	ASTM D695
Arlon CLTE-P Pre-Preg Bonding Layer Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of ..
Compressive Modulus	1.55 GPa	225 ksi	ASTM D695
Quadrant EPP Semitron® ESd 500 HR PTFE, static dissipative, compression molded (ASTM Product Data Sheet)