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Arlon CLTE-P Pre-Preg Bonding Layer
| Category | Polymer , Thermoplastic , Fluoropolymer , PTFE |
| Manufacturer | Arlon |
| Trade Name | |
| Port | Ningbo port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Arlon CLTE-P Pre-Preg Bonding Layer.pdf  |
| Price | EMAIL US sales@lookpolymers.com |
Material Notes:
Arlon's CLTE-P Prepreg Bonding Layer is a ceramic filled PTFE coated glass stock that is used as a bonding ply for CLTE, CLTE-X or CLTE-AT laminates. CLTE-P is a pre-preg material that consists of woven fiberglass fabric coated with a proprietary resin formulation. The Proprietary resin is thermoplastic, not thermoset in nature.Information provided by Arlon Materials for Electronics (MED).
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Density | 2.38 g/cc | 0.0860 lb/in³ | ASTM D792 Method A |
| Water Absorption | 0.040 % | 0.040 % | IPC TM-650 2.6.2.2 |
| Thickness | 0.0610 microns | 0.00240 mil | After lamination |
| 0.0813 microns | 0.00320 mil | As received | |
| 1.57 microns | 0.0620 mil | Thickness of laminate tested | |
| Outgassing - Total Mass Loss | 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Collected Volatiles; NASA SP-R-0022A |
| 0.00 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.00 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
Water Vapor Recovered; NASA SP-R-0022A | |
| 0.020 % @Pressure <=1.33e-10 MPa, Temperature 125 °C |
0.020 % @Pressure <=1.93e-8 psi, Temperature 257 °F |
NASA SP-R-0022A |
| Mechanical Properties | Metric | English | Comments |
|---|---|---|---|
| Tensile Strength | 48.3 MPa | 7000 psi | Cross; ASTM D882 |
| 56.5 MPa | 8200 psi | Machine; ASTM D882 | |
| Modulus of Elasticity | 3.19 GPa | 462 ksi | Cross; ASTM D638 |
| 3.25 GPa | 471 ksi | Machine; ASTM D638 | |
| Flexural Modulus | >= 2.59 GPa | >= 375 ksi | ASTM D790 |
| Compressive Modulus | 1.55 GPa | 225 ksi | ASTM D695 |
| Peel Strength | 1.23 kN/m | 7.00 pli | After Thermal Stress; IPC TM-650 2.4.8 |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| CTE, linear | 10.0 µm/m-°C @Temperature 0.000 - 100 °C |
5.56 µin/in-°F @Temperature 32.0 - 212 °F |
x direction; IPC TM-650 2.4.24 |
| 12.0 µm/m-°C @Temperature 0.000 - 100 °C |
6.67 µin/in-°F @Temperature 32.0 - 212 °F |
y direction; IPC TM-650 2.4.24 | |
| CTE, linear, Transverse to Flow | 35.0 µm/m-°C @Temperature 0.000 - 100 °C |
19.4 µin/in-°F @Temperature 32.0 - 212 °F |
z direction; IPC TM-650 2.4.24 |
| Thermal Conductivity | 0.500 W/m-K @Temperature 100 °C |
3.47 BTU-in/hr-ft²-°F @Temperature 212 °F |
ASTM E1225 |
| Flammability, UL94 | V-0 | V-0 | Vertical Burn |
| Electrical Properties | Metric | English | Comments |
|---|---|---|---|
| Volume Resistivity | 1.40e+14 ohm-cm | 1.40e+14 ohm-cm | C96/35/90; IPC TM-650 2.5.17.1 |
| Surface Resistance | 1.30e+12 ohm | 1.30e+12 ohm | C96/35/90; IPC TM-650 2.5.17.1 |
| Dielectric Constant | 2.94 @Frequency 1.00e+10 Hz |
2.94 @Frequency 1.00e+10 Hz |
C23/50; IPC TM-650 2.5.5.5 |
| Dielectric Breakdown | >= 45000 V | >= 45000 V | D48/50; ASTM D149 |
| Dissipation Factor | 0.0025 @Frequency 1.00e+10 Hz |
0.0025 @Frequency 1.00e+10 Hz |
C23/50; IPC TM-650 2.5.5.5 |
| Arc Resistance | >= 180 sec | >= 180 sec | D48/50; ASTM D495 |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Temperature Coefficient of Dielectric (ppm/°C) | -12 | IPC TM-650 2.5.5.5 (-10 - 140°C) |
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