Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 0.620 g/cc @Temperature 50.0 °C |
0.0224 lb/in³ @Temperature 122 °F |
Cure Cycle: 5 hours at 50°C; ASTM D792 |
Hexcel® Redux® 830 Two-Part Epoxy Syntactic Paste Adhesive Redux® 830 is a low density, self-extinguishing, syntactic, room temperature curing, two-part, epoxy paste adhesive. Redux® 830 is supplied as a 1.5 working kit.Features: Low density; Self-extingu.. |