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Polymer Property : ESCR 100% Igepal® = 20 hour Product List

Physical Properties

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Physical Properties Metric English Comments
ESCR 100% Igepal® 20 hour
20 hour
Condition A; ASTM D1693
Network Polymers NPP 50-0158
Description: High Density Polyethylene (HDPE)Information provided by Network Polymers Inc.
ESCR 100% Igepal® 20 hour
20 hour
Condition A, F50; ASTM D 1693
NOVA Chemicals Sclair® 19C (High Gloss) HDPE Blow Molding Resin
19C complies with the U.S. FDA specifications for olefin polymers and may thus be used in the United States as an article or component of an article intended for use in contact with food, without te..
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
ASTM D1693
Unipetrol PE HD LITEN® MS 57 HDPE
Made for injection molding applications.Information provided by Unipetrol RPA
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
ASTM D1693
Unipetrol PE HD LITEN® RL 58 HDPE
Made for injection molding and special applicationsInformation provided by Unipetrol RPA
ESCR 100% Igepal® 20 hour
20 hour
F50; ASTM D1963
ExxonMobil HDPE HYA 800 High Density Polyethylene Resin
Product Description: HYA 800 is a homopolymer HDPE grade, characterized by high stiffness, high rigidity and high flow.Availability: Africa & Middle East, Asia Pacific and Europe Additive: Thermal ..
ESCR 100% Igepal® 20 hour
20 hour
ASTM D1693 Condition B
ExxonMobil Paxon™ AA60-003 Blow Molding Resin
Product Description: AA60-003 is a medium molecular weight distribution high density polyethylene which is characterized by high stiffness, excellent melt uniformity, and chemical inertness.Availabi..
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
F<sub>50</sub>; Molded and tested in accordance with ASTM D4976; ASTM D1693
Dow DNDA-7144 NT 7 Linear Low Density Polyethylene Resin
DOW DNDA-7144 NT 7 is produced using UNIPOL™ PE process technology. It is intended for use in injection molding applications such as large industrial containers and trash cans. Information provide..
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
F<sub>50</sub>; Molded and tested in accordance with ASTM D4976; ASTM D1693
Dow DNDA-8320 NT 7 Linear Low Density Polyethylene Resin
DOW DNDA-8320 NT 7 is produced using UNIPOL™ PE process technology. It is intended for use in general purpose injection molding applications. Information provided by Dow
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
F<sub>50</sub>; Molded and tested in accordance with ASTM D4976; ASTM D1693
Dow GRSN-9820 NT 7 Linear Low Density Polyethylene Granular Solid
DOW GRSN-9820 NT 7 is produced using UNIPOL™ PE process technology and is supplied in granular form. This resin is specifically designed as a carrier resin for color concentrates and other master ..
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
F<sub>50</sub>; Molded and tested in accordance with ASTM D4976; ASTM D1693
Dow UNIVAL™ DMDC-6400 NT 7 High Density Polyethylene Resin (HDPE)
Excellent process-ability Moderate swell Complies with U.S. FDA 21 CFR 177.1520 (c) 2.2 UNIVAL™ DMDC-6400 NT 7 is a multipurpose polymer designed for producing containers used to package dairy, wat..
ESCR 100% Igepal® 20 hour

@Temperature 50.0 °C
20 hour

@Temperature 122 °F
F<sub>50</sub>; Molded and tested in accordance with ASTM D4976; ASTM D1693
Dow UNIVAL™ DMDH-6400 NT 7 High Density Polyethylene Resin (HDPE)
Moderate swell Complies with U.S. FDA 21 CFR 177.1520 (c) 2.2 UNIVAL™ DMDH-6400 NT 7 is a multipurpose polymer designed for producing containers used to package dairy, water and fruit drinks. In a..
ESCR 100% Igepal® 20 hour

@Thickness 2.00 mm,
Temperature 50.0 °C
20 hour

@Thickness 0.0787 in,
Temperature 122 °F
0.3 mm notched-plaques; ASTM-D1693
Braskem GD5160 HDPE Blow Molding Polyethylene Homopolymer
GD5160 is a high-density polyethylene homopolymer with high density and stiffness combined with high impact resistance and productivity. It was developed for the blow-molding segment. It is used in ..
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