Physical Properties | Metric | English | Comments |
---|---|---|---|
Brookfield Viscosity | 255000 - 380000 cP @Temperature 25.0 °C |
255000 - 380000 cP @Temperature 77.0 °F |
Spindle 14 @ 1rpm |
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with .. |