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Polymer Property : Brookfield Viscosity = 255000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Brookfield Viscosity 255000 - 380000 cP

@Temperature 25.0 °C
255000 - 380000 cP

@Temperature 77.0 °F
Spindle 14 @ 1rpm
Lord Adhesives Thermosetâ„¢ ME-430 Epoxy Board Level Encapsulant
LORD Thermosetâ„¢ ME-430 encapsulant is a onecomponent, semiconductor grade epoxy designed for the encapsulation of Chip-on-Board (COB) devices. It is composed of 100% solids and formulated with ..
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