Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.0750 - 1.00 microns | 0.00295 - 0.0394 mil | Film Thickness |
Dow SiLK™ D Semiconductor Dielectric Resin SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow |