Polymer Property : Thickness = 0.00295 mil Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Thickness	0.0750 - 1.00 microns	0.00295 - 0.0394 mil	Film Thickness
Dow SiLK™ D Semiconductor Dielectric Resin SiLK™ D resin provides a more controlled coefficient of thermal expansion (CTE) profile at elevated temperatures as compared to earlier versions of SiLK™ resin.Information provided by Dow