Physical Properties | Metric | English | Comments |
---|---|---|---|
Thickness | 0.330 - 0.465 microns | 0.0130 - 0.0183 mil | 2000-4000 rpm |
Dow SiLK™ I300 380 Semiconductor Dielectric Resin SiLK™ I300 380 is designed for easy integration and extendibility, and its formulations offer a robust feature set. High thermal stability and fracture toughness means SilK™ I300 380 is compatibl.. |