Polymer Property : Viscosity = 34000 cP Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Viscosity	26000 - 34000 cP @Temperature 175 °C	26000 - 34000 cP @Temperature 347 °F	Automatic orifice Viscosity
Cookson Group Plaskon® 3400F Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..