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Polymer Property : Viscosity = 26000 cP Product List

Physical Properties

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Physical Properties Metric English Comments
Viscosity 26000 - 34000 cP

@Temperature 175 °C
26000 - 34000 cP

@Temperature 347 °F
Automatic orifice Viscosity
Cookson Group Plaskon® 3400F Epoxy Molding Compound  (discontinued **)
Test specimens were transfer molded and post cured 4 hours at 175°C.A fast curing, reduced-stress epoxy molding compound for the encapsulation of semiconductor devices including DIPs, PLCCs, SOICs ..
Viscosity 26000 cP

@Temperature 25.0 °C
26000 cP

@Temperature 77.0 °F
Momentive Performance Materials RTV21 Pink General Purpose Potting/Encapsulating Compound
Two-part condensation cure. Two-part condensation cure silicones RTVs are designed to cute at room temperature, and can be applied at temperature up to one inch (2.5 cm). These are very tough mate..
Viscosity 26000 cP
26000 cP
Mixed (rv #7, 10 rpm)
Tra-Con Tra-Bond FDA2T Food and Drug Application Epoxy Adhesive
TRA-BOND FDA-2T is a thixotropic epoxy resin system specifically developed for medical device applications. It has been tested in accordance with USP biological reactivity tests, in vivo and receive..
Viscosity 26000 cP

@Temperature 25.0 °C
26000 cP

@Temperature 77.0 °F
Mixed (rv #7, 10 rpm)
Tra-Con Tra-Bond FS25
Information provided by Tra-Con Inc.
Viscosity 26000 cP

@Temperature 25.0 °C
26000 cP

@Temperature 77.0 °F
Cytec (Conap) FR-1047 / EA-117 Conapoxy® Resin / Conacure® Hardener
Epoxy Potting and Encapsulating Systems for Electronic ApplicationsHigh technology epoxy resin systems for potting and encapsulation, for the defense, aerospace, electronics, computer, automotive an..
Viscosity 26000 cP
26000 cP
Dymax 912 Strain Relief, Wire and Parts Tacking Adhesive
High Performance Light-Curing Adhesives and Coatings for Electronic AssemblyDymax 912 Strain Relief, Wire and Parts Tacking AdhesiveFast curing, withstands wave soldering while resisting most solven..
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