Physical Properties | Metric | English | Comments |
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Spiral Flow | 63.0 - 130 cm | 24.8 - 51.2 in | Average value: 88.0 cm Grade Count:7 |
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o.. |
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Spiral Flow | 100 - 130 cm | 39.4 - 51.2 in | 177°C/1000 psi |
Cookson Group Plaskon® S-7P Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically .. |