Polymer Property : Spiral Flow = 24.8 in Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	63.0 - 130 cm	24.8 - 51.2 in	Average value: 88.0 cm Grade Count:7
Overview of materials for Epoxy Encapsulant, Unreinforced This property data is a summary of similar materials in the MatWeb database for the category "Epoxy Encapsulant, Unreinforced". Each property range of values reported is minimum and maximum values o..
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi
Cookson Group Plaskon® 440 Mineral Filled Novolac Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.Combines exceptional reliability with wide molding process latitude. This material is designed to encapsulate semiconductor devi..
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi
Cookson Group Plaskon® 1002 Conventional Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low cost, low stress, conventional molding compound recommended for high volume commodity-type packages that house simple linea..
Spiral Flow	63.0 - 87.0 cm	24.8 - 34.3 in	177°C/1000 psi
Cookson Group Plaskon® 3400 Epoxy Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A reduced-stress epoxy molding compound for the encapsulation of a variety of semiconductor devices ranging from small lead count..