Physical Properties | Metric | English | Comments |
---|---|---|---|
Spiral Flow | 80.0 - 110 cm | 31.5 - 43.3 in | 177°C/1000 psi |
Cookson Group Plaskon® S-7S Epoxy Encapsulant
(discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically .. |