Polymer Property : Spiral Flow = 110 cm Product List

Physical Properties

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Physical Properties	Metric	English	Comments
Spiral Flow	80.0 - 110 cm	31.5 - 43.3 in	177°C/1000 psi
Cookson Group Plaskon® S-7S Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A low stress, low viscosity epoxy encapsulant designed for packaging stress-sensitive semiconductor devices. It is specifically ..