Polymer Property : Spiral Flow = 31.9 in Product List

Physical Properties

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Physical Properties	Metric	English
Spiral Flow	81.0 cm	31.9 in
Cookson Group Plaskon® ULS-12 Epoxy Encapsulant (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.A state-of-the-art, ultra low stress epoxy encapsulant designed for packaging large, stress-sensitive DIPs, PLCCs and QFPs. It i..
Spiral Flow	81.0 cm	31.9 in
Cookson Group Plaskon® ULS-12LA Molding Compound (discontinued **) Test specimens were transfer molded and post cured 4 hours at 175°C.An ultra low stress, low alpha emission molding compound designed for packaging stress-sensitive memory devices such as TSOPs and..