Tra-Con Tra-Bond FS291 Thixotropic Room Temperature Cure Epoxy Adhesive

TRA-BOND FS291 is a thixotropic room temperature cure epoxy adhesive system developed for structural bonding applications on vertical or overhead surfaces where its no-sag characteristics are critical. This medium exotherming system exhibits excellent flow and wetting characteristics for precisely located dispensing from static mixing cartridges. Fully cured TRA-BOND FS291 may be employed on a wide variety of substrates including glass, most metals, and variety of plastics and provides excellent resistance to salt solutions, mild acids and alkalis, and many other chemicals including petroleum solvents, lubricating oils, and alcohol.Information provided by Tra-Con Inc.