Material Notes:
TRA-BOND F175T is a thixotropic, one part UV curing adhesive designed for bonding metals, ceramics and most rigid polymers. It is an excellent adhesive for fiber optic terminations where fast cure with ultraviolet light is desired. It is also recommended for electronic applications as it has very low ionic impurities. TRA-BOND F175T is a unique system which produces very little shrinkage upon cure. It is an excellent choice for high humidity environments or applications requiring thermal cycling. HANDLING: TRA-BOND F175T should be stored with an air space to ensure maximum stability. Do not purge with nitrogen.Information provided by Tra-Con Inc.