Sumitomo Bakelite North America EM 7302 Hardware Grade Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset
Manufacturer	Sumitomo Bakelite North America
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Sumitomo Bakelite North America EM 7302 Hardware Grade Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
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Material Notes:

Long fiberglass reinforced epoxy molding compound which features high strength and toughness for structural components. This compound is designed for applications requiring Mil-M-46069 certification.Information provided by Vyncolit, a Sumitomo Bak Group

Physical Properties	Metric	English	Comments
Density	1.85 g/cc	0.0668 lb/inÂ³	Relative Density; ASTM D792
Linear Mold Shrinkage	0.0010 cm/cm	0.0010 in/in	Compression Molding; ASTM D955

Mechanical Properties	Metric	English	Comments
Hardness, Rockwell M	105	105	ASTM D2583
Tensile Strength at Break	138 MPa	20000 psi	ASTM D638
Flexural Strength	345 MPa	50000 psi	At Rupture; ASTM D790
Flexural Modulus	24.0 GPa	3480 ksi	ASTM D790
Compressive Strength	255 MPa	37000 psi	ASTM D695
Izod Impact, Notched	16.0 J/cm	30.0 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
CTE, linear, Parallel to Flow	12.0 Âµm/m-Â°C @Temperature 20.0 Â°C	6.67 Âµin/in-Â°F @Temperature 68.0 Â°F	ASTM E-831
Thermal Conductivity	0.420 W/m-K	2.91 BTU-in/hr-ftÂ²-Â°F	ASTM C-518
Deflection Temperature at 1.8 MPa (264 psi)	>= 250 Â°C	>= 482 Â°F	Post Baked; ASTM D648A

Electrical Properties	Metric	English	Comments
Dielectric Constant	5.8 @Frequency 1e+6 Hz	5.8 @Frequency 1e+6 Hz	Dry; ASTM D150
Dielectric Strength	12.8 kV/mm	325 kV/in	60Hz, Step-by-Step, wet; ASTM D149
Dissipation Factor	0.017 @Frequency 1e+6 Hz	0.017 @Frequency 1e+6 Hz	Dry; ASTM D150
Arc Resistance	120 sec	120 sec	ASTM D495

Descriptive Properties	Value	Comments
Color	Black, Natural
Form	Coarse Flake - 1/2" Chop
Main Filler	Glass Fiber
Molding Method	Compression, transfer

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