Sumitomo Bakelite North America E 8940SG Electrical Encapsulation Grade Epoxy

Category	Polymer , Thermoset , Epoxy , Epoxy, Encapsulating, Glass or Mineral Filled , Filled/Reinforced Thermoset
Manufacturer	Sumitomo Bakelite North America
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Sumitomo Bakelite North America E 8940SG Electrical Encapsulation Grade Epoxy.pdf
Price	EMAIL US sales@lookpolymers.com
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Material Notes:

Mineral reinforced epoxy molding compound formulated for the encapsulation of electronic devices requiring high quality, exceptional reliability, and outstanding moldability. USES: Passive electronics, RC networks and rectifiers.Information provided by Vyncolit, a Sumitomo Bak Group

Physical Properties	Metric	English	Comments
Bulk Density	0.800 g/cc	0.0289 lb/inÂ³	Powder Density; ASTM D1895
Density	1.80 g/cc	0.0650 lb/inÂ³	Relative Density; ASTM D792
Linear Mold Shrinkage	0.0030 - 0.0050 cm/cm	0.0030 - 0.0050 in/in	Compression Molding; ASTM D955

Mechanical Properties	Metric	English	Comments
Tensile Strength at Break	86.0 MPa	12500 psi	ASTM D638
Flexural Strength	120 MPa	17400 psi	At Rupture; ASTM D790
Flexural Modulus	15.2 GPa	2200 ksi	ASTM D790
Compressive Strength	240 MPa	34800 psi	ASTM D695
Izod Impact, Notched	0.190 J/cm	0.356 ft-lb/in	ASTM D256

Thermal Properties	Metric	English	Comments
CTE, linear, Parallel to Flow	22.0 Âµm/m-Â°C @Temperature 20.0 Â°C	12.2 Âµin/in-Â°F @Temperature 68.0 Â°F	ASTM E-831
Thermal Conductivity	0.720 W/m-K	5.00 BTU-in/hr-ftÂ²-Â°F	ASTM C-518
Deflection Temperature at 1.8 MPa (264 psi)	225 Â°C	437 Â°F	Post Baked; ASTM D648A
Flammability, UL94	V-0 @Thickness 1.60 mm	V-0 @Thickness 0.0630 in

Electrical Properties	Metric	English	Comments
Dielectric Constant	3.0 @Frequency 1e+6 Hz	3.0 @Frequency 1e+6 Hz	Dry; ASTM D150
Dielectric Strength	14.4 kV/mm	366 kV/in	60Hz, Step-by-Step, dry; ASTM D149
Dissipation Factor	0.0060 @Frequency 1e+6 Hz	0.0060 @Frequency 1e+6 Hz	Dry; ASTM D150

Descriptive Properties	Value	Comments
Color	Black
Form	Granular
Main Filler	Mineral
Molding Method	Compression, transfer

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