Category | Polymer , Thermoset , Epoxy , Filled/Reinforced Thermoset |
Manufacturer | Sumitomo Bakelite North America |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Sumitomo Bakelite North America E 8353-706R-1 Hardware Grade Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Density | 1.98 g/cc | 0.0715 lb/in³ | Relative Density; ASTM D792 |
Linear Mold Shrinkage | 0.0050 cm/cm | 0.0050 in/in | Compression Molding; ASTM D955 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength at Break | 72.0 MPa | 10400 psi | ASTM D638 |
Flexural Strength | 114 MPa | 16500 psi | At Rupture; ASTM D790 |
Flexural Modulus | 18.0 GPa | 2610 ksi | ASTM D790 |
Compressive Strength | 235 MPa | 34100 psi | ASTM D695 |
Izod Impact, Notched | 0.220 J/cm | 0.412 ft-lb/in | ASTM D256 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 25.0 µm/m-°C @Temperature 20.0 °C |
13.9 µin/in-°F @Temperature 68.0 °F |
ASTM E-831 |
Thermal Conductivity | 0.600 W/m-K | 4.16 BTU-in/hr-ft²-°F | ASTM C-518 |
Deflection Temperature at 1.8 MPa (264 psi) | >= 282 °C | >= 540 °F | Post Baked; ASTM D648A |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 4.5 @Frequency 1e+6 Hz |
4.5 @Frequency 1e+6 Hz |
Wet; ASTM D150 |
Dielectric Strength | 14.2 kV/mm | 361 kV/in | 60Hz, Step-by-Step, wet; ASTM D149 |
15.2 kV/mm | 386 kV/in | 60Hz, Step-by-Step, dry; ASTM D149 | |
16.4 kV/mm | 417 kV/in | 60Hz, Short Time, wet; ASTM D149 | |
17.1 kV/mm | 434 kV/in | 60Hz, Short Time, dry; ASTM D149 | |
Dissipation Factor | 0.010 @Frequency 1e+6 Hz |
0.010 @Frequency 1e+6 Hz |
wet; ASTM D150 |
Arc Resistance | 180 sec | 180 sec | ASTM D495 |
Descriptive Properties | Value | Comments |
---|---|---|
Color | Black | |
Form | Granular | |
Main Filler | Glass Fiber & Mineral | |
Molding Method | Compression, transfer |