Category | Polymer , Thermoset , Epoxy , Epoxy, Molded, Glass Fiber Filler , Filled/Reinforced Thermoset |
Manufacturer | Sumitomo Bakelite North America |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Sumitomo Bakelite North America E 2748-9641D Short Glass Fiber Reinforced Epoxy.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Bulk Density | 0.800 g/cc | 0.0289 lb/in³ | ASTM D1895 |
Density | 1.80 g/cc | 0.0650 lb/in³ | ASTM D792 |
Water Absorption | 0.15 % @Temperature 50.0 °C, Time 173000 sec |
0.15 % @Temperature 122 °F, Time 48.0 hour |
ASTM D570 |
Linear Mold Shrinkage | 0.0020 - 0.0040 cm/cm | 0.0020 - 0.0040 in/in | ASTM D955 |
Mechanical Properties | Metric | English | Comments |
---|---|---|---|
Tensile Strength at Break | 71.0 MPa | 10300 psi | ASTM D638 |
Flexural Strength | 145 MPa | 21000 psi | at rupture; ASTM D790 |
Flexural Modulus | 19.0 GPa | 2760 ksi | ASTM D790 |
Compressive Strength | 240 MPa | 34800 psi | ASTM D695 |
Izod Impact, Notched | 0.310 J/cm | 0.581 ft-lb/in | ASTM D256 |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
CTE, linear, Parallel to Flow | 27.0 µm/m-°C | 15.0 µin/in-°F | ASTM E831 |
Deflection Temperature at 1.8 MPa (264 psi) | 150 °C | 302 °F | As Molded; ASTM D648A |
>= 280 °C | >= 536 °F | Post Baked; ASTM D648A |
Electrical Properties | Metric | English | Comments |
---|---|---|---|
Dielectric Constant | 4.0 @Frequency 1.00e+6 Hz |
4.0 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
Dielectric Strength | 13.2 kV/mm @Frequency 60.0 Hz |
335 kV/in @Frequency 60.0 Hz |
step-by-step, wet; ASTM D149 |
15.3 kV/mm @Frequency 60.0 Hz |
389 kV/in @Frequency 60.0 Hz |
short time, wet; ASTM D149 | |
Dissipation Factor | 0.020 @Frequency 1.00e+6 Hz |
0.020 @Frequency 1.00e+6 Hz |
wet; ASTM D150 |
Arc Resistance | 180 sec | 180 sec | ASTM D495 |
Descriptive Properties | Value | Comments |
---|---|---|
Color | Black | |
Form | Granular | |
Molding Method | Compression | |
Transfer |