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Resinlab® SEC1244 Silver Filled Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resinlab®
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resinlab® SEC1244 Silver Filled Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Resinlab™ SEC1244 is a silver filled, two component, elevated temperature curing epoxy adhesive. It provides excellent electrical conductivity useful in many electronic applications. It is a smooth 100% solids thixotropic solvent free paste provided in a 1:1 weight ratio. This product can cure very quickly at high temperatures. 5 minutes at 150°C, 15 minutes at 120°C or 60 minutes at 100°C can be used as guides to determining optimum processing conditions. SEC1244 provides the additional benefit of very high thermal conductivity due to its high loading of pure silver. Alloys are not used as they have been proven to be less reliable. It gives good environmental protection while having tenacious adhesion to various metals and other common assembly materials.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Physical Properties	Metric	English	Comments
Specific Gravity	3.90 g/cc	3.90 g/cc	Mixed; TM R050-16
Water Absorption	<= 0.20 % @Time 86400 sec	<= 0.20 % @Time 24.0 hour	TM R050-35
Viscosity	51500 cP	51500 cP	10.0 rpm; TM R050-12
	126000 cP	126000 cP	5.0 rpm; TM R050-12
	234000 cP	234000 cP	Mixed, 2.5 rpm; TM R050-12

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	80	80	TM R050-17
Tensile Strength at Break	34.5 MPa	5000 psi	TM R050-36
Tensile Strength, Ultimate	34.5 MPa	5000 psi	TM R050-36
Tensile Strength, Yield	24.1 MPa	3500 psi	TM R050-36
Elongation at Break	1.0 - 2.0 %	1.0 - 2.0 %	TM R050-36
Tensile Modulus	4.14 GPa	600 ksi	TM R050-36
Compressive Yield Strength	72.4 MPa	10500 psi	TM R050-38
Compressive Strength	86.2 MPa	12500 psi	Break; TM R050-38
	93.1 MPa	13500 psi	Ultimate; TM R050-38
Compressive Modulus	5.17 GPa	750 ksi	TM R050-38
Adhesive Bond Strength	3.45 MPa	500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Thermal Properties	Metric	English	Comments
CTE, linear	51.5 µm/m-°C @Temperature <=99.0 °C	28.6 µin/in-°F @Temperature <=210 °F	below Tg
	101.4 µm/m-°C @Temperature >=99.0 °C	56.33 µin/in-°F @Temperature >=210 °F	above Tg
Thermal Conductivity	2.19 W/m-K	15.2 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	99.0 °C	210 °F	TM R050-25

Electrical Properties	Metric	English	Comments
Volume Resistivity	0.00060 ohm-cm	0.00060 ohm-cm	Cured: 15 minutes at 25°C

Processing Properties	Metric	English	Comments
Cure Time	5.00 min @Temperature 150 °C	0.0833 hour @Temperature 302 °F
	60.0 min @Temperature 100 °C	1.00 hour @Temperature 212 °F
Pot Life	>= 1440 min	>= 1440 min	Mass: 50g; TM R050-19

Descriptive Properties	Value	Comments
Color	Silver
Mix Ratio	1:1	Weight
	109:100	Volume

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