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Resinlab® EP1330 Heat Cure Epoxy Polymer System

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resinlab®
Trade Name
Port	Ningbo port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resinlab® EP1330 Heat Cure Epoxy Polymer System.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Resinlab™ EP1330 and EP1330LV are one part heat cure epoxy polymer systems. They can also be used as a small mass potting or staking compounds, or a dam adhesive in and “dam and fill” application, or general polymer systems where the application requires high thermal conductivity, low shrinkage, low CTE and excellent adhesion to a wide variety of plastics, metals and circuit board materials. EP1330 is a thixotropic adhesive with slight sag upon curing, EP1330LV is a semi-free flowing material which will self level, but still maintain a conformal build on circuit board components.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Physical Properties	Metric	English	Comments
Specific Gravity	1.91 g/cc	1.91 g/cc	TM R050-16
Water Absorption	0.030 % @Time 86400 sec	0.030 % @Time 24.0 hour	TM R050-35
Viscosity	500000 cP	500000 cP	RVT, #7, 2.5 rpm; TM R050-12

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	90	90	TM R050-17
Tensile Strength at Break	48.3 MPa	7000 psi	TM R050-36
Tensile Strength, Ultimate	48.3 MPa	7000 psi	TM R050-36
Tensile Strength, Yield	31.0 MPa	4500 psi	TM R050-36
Elongation at Break	0.00 - 1.0 %	0.00 - 1.0 %	TM R050-36
Tensile Modulus	8.27 GPa	1200 ksi	TM R050-36
Compressive Yield Strength	96.5 MPa	14000 psi	TM R050-38
Compressive Strength	110 MPa	16000 psi	Break; TM R050-38
	117 MPa	17000 psi	Ultimate; TM R050-38
Compressive Modulus	5.52 GPa	800 ksi	TM R050-38
Adhesive Bond Strength	10.3 MPa	1500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Thermal Properties	Metric	English	Comments
CTE, linear	30.0 µm/m-°C	16.7 µin/in-°F
Thermal Conductivity	1.07 W/m-K	7.43 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	150 °C	302 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	92.0 °C	198 °F	TM R050-25

Electrical Properties	Metric	English
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Dielectric Constant	3.5 @Frequency 100 Hz, Temperature 25.0 °C	3.5 @Frequency 100 Hz, Temperature 77.0 °F
Dielectric Strength	17.3 kV/mm	440 kV/in

Processing Properties	Metric	English
Cure Time	5.00 - 10.0 min @Temperature 150 °C	0.0833 - 0.167 hour @Temperature 302 °F
	15.0 min @Temperature 120 °C	0.250 hour @Temperature 248 °F
	30.0 min @Temperature 110 °C	0.500 hour @Temperature 230 °F

Descriptive Properties	Value	Comments
Color	Black

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