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Resinlab® EP1026 Clear Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resinlab®
Trade Name
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Resinlab® EP1026 Clear Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com
	Online Service lookpolymers 27660005

Material Notes:

Resinlab™ EP1026 Clear is a two part unfilled epoxy adhesive designed for high speed bonding of metals, ceramics, and most plastics. It cures to a tough semi-rigid material, and is free flowing in viscosity. It gives good resistance to water, salt spray, inorganic acids and bases, and most organic solvents. It was especially formulated to a 1:1 mix ratio for use in either MMD equipment or side-by-side dual cartridges for easy dispensing. A handling cure is normally achieved at room temperature within 20-30 minutes with full cure in 24 hours. An elevated temperature cure schedule can be used to reach final properties quickly.Information Provided by Resinlab L.L.C., an Ellsworth Adhesives Company.

Physical Properties	Metric	English	Comments
Specific Gravity	1.12 g/cc	1.12 g/cc	Part B; TM R050-16
	1.14 g/cc	1.14 g/cc	Mixed; TM R050-16
	1.16 g/cc	1.16 g/cc	Part A; TM R050-16
Water Absorption	1.56 % @Time 86400 sec	1.56 % @Time 24.0 hour	TM R050-35
Viscosity	15000 cP	15000 cP	Part B, RVT, #7, 2.5 rpm; TM R050-12
	15500 cP	15500 cP	Mixed; TM R050-12
	16000 cP	16000 cP	Part A, RVT, #6, 2.5 rpm; TM R050-12

Mechanical Properties	Metric	English	Comments
Hardness, Shore D	85	85	TM R050-17
Tensile Strength at Break	44.8 MPa	6500 psi	TM R050-36
Tensile Strength, Ultimate	51.7 MPa	7500 psi	TM R050-36
Tensile Strength, Yield	27.6 MPa	4000 psi	TM R050-36
Elongation at Break	10 - 20 %	10 - 20 %	TM R050-36
Tensile Modulus	3.10 GPa	450 ksi	TM R050-36
Compressive Yield Strength	27.6 MPa	4000 psi	TM R050-38
Compressive Strength	>= 193 MPa	>= 28000 psi	Break; TM R050-38
	>= 193 MPa	>= 28000 psi	Ultimate; TM R050-38
Compressive Modulus	1.38 GPa	200 ksi	TM R050-38
Adhesive Bond Strength	17.2 MPa	2500 psi	Lap shear; 2024 T3 Al Abraded / MEK Wipe; TM R050-37

Thermal Properties	Metric	English	Comments
CTE, linear	60.0 µm/m-°C @Temperature <=34.0 °C	33.3 µin/in-°F @Temperature <=93.2 °F	below Tg
	209 µm/m-°C @Temperature >=34.0 °C	116 µin/in-°F @Temperature >=93.2 °F	above Tg
Thermal Conductivity	0.185 W/m-K	1.28 BTU-in/hr-ft²-°F
Maximum Service Temperature, Air	90.0 °C	194 °F
Minimum Service Temperature, Air	-40.0 °C	-40.0 °F
Glass Transition Temp, Tg	34.0 °C	93.2 °F	TM R050-25

Optical Properties	Metric	English	Comments
Transmission, Visible	90 %	90 %	clear; thickness not quantified

Electrical Properties	Metric	English
Volume Resistivity	8.00e+14 ohm-cm	8.00e+14 ohm-cm
Dielectric Constant	4.5 @Frequency 100 Hz, Temperature 25.0 °C	4.5 @Frequency 100 Hz, Temperature 77.0 °F
Dielectric Strength	16.1 kV/mm	410 kV/in

Processing Properties	Metric	English	Comments
Pot Life	3.0 - 5.0 min	3.0 - 5.0 min	Mass: 25g; TM R050-19

Descriptive Properties	Value	Comments
Color	Clear
Mix Ratio	1:1	Weight and Volume

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