Category | Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive |
Manufacturer | Resin Technology Group |
Trade Name | |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Resin Technology Group 1161 Oxy-Bond™ Two-Component Epoxy Adhesive.pdf |
Price | EMAIL US sales@lookpolymers.com |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Maximum Service Temperature, Air | 110 °C | 230 °F | |
Minimum Service Temperature, Air | -60.0 °C | -76.0 °F |
Processing Properties | Metric | English | Comments |
---|---|---|---|
Cure Time | 120 min @Temperature 65.0 °C |
2.00 hour @Temperature 149 °F |
|
1440 min @Temperature 23.0 °C |
24.0 hour @Temperature 73.4 °F |
||
Pot Life | 18 min | 18 min | |
18 min | 18 min |
Descriptive Properties | Value | Comments |
---|---|---|
Viscosity | Thixotropic Paste |