Resin Technology Group 1161 Oxy-Bond™ Two-Component Epoxy Adhesive

Category	Polymer , Adhesive , Thermoset , Epoxy , Epoxy Adhesive
Manufacturer	Resin Technology Group
Trade Name
Port	Shanghai port,China
Trade Terms	EXW, FOB, CFR, CIF
Payment Terms	L/C, T/T, PayPal
Download PDF	Resin Technology Group 1161 Oxy-Bond™ Two-Component Epoxy Adhesive.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Oxy-Bond and Millenium Adhesive SystemsEngineered for strength, durability, lightness, and formability, our Oxy-Bond and Millenium lines offer adhesives with physical and electrical properties to match a variety of specific application parameters, including MIL-APPROVED. Custom designed bonding products and expert technical assistance are always available.Resin Technology Group 1161 Oxy-Bond™ Two-Component Epoxy AdhesiveSag resistant metal bonding adhesive.

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	110 °C	230 °F
Minimum Service Temperature, Air	-60.0 °C	-76.0 °F

Processing Properties	Metric	English
Cure Time	120 min <br>@Temperature 65.0 °C	2.00 hour <br>@Temperature 149 °F
	1440 min <br>@Temperature 23.0 °C	24.0 hour <br>@Temperature 73.4 °F
Pot Life	18 min	18 min
	18 min	18 min

Descriptive Properties	Value	Comments
Viscosity	Thixotropic Paste

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