Category | Polymer , Adhesive , Thermoset |
Manufacturer | Parker Chomerics |
Trade Name | CHO-BOND |
Port | Shanghai port,China |
Trade Terms | FOB, CFR, CIF |
Payment Terms | L/C, T/T, Western Union |
Download PDF | Parker Chomerics CHO-BOND 4041 Part B Conductive Adhesive.pdf |
Price | EMAIL US sales@lookpolymers.com |
Physical Properties | Metric | English | Comments |
---|---|---|---|
Specific Gravity | >= 1.00 g/cc | >= 1.00 g/cc |
Thermal Properties | Metric | English | Comments |
---|---|---|---|
Flash Point | >= 93.3 °C | >= 200 °F |
Component Elements Properties | Metric | English | Comments |
---|---|---|---|
Copper, Cu | >= 75 % | >= 75 % | |
Silver, Ag | <= 20 % | <= 20 % |
Descriptive Properties | Value | Comments |
---|---|---|
Color | Silver | |
Physical Form | Silver paste mild odor | |
Silicone Resin % | <10 |