| Category | Polymer , Adhesive , Thermoset |
| Manufacturer | Parker Chomerics |
| Trade Name | CHO-BOND |
| Port | Shanghai port,China |
| Trade Terms | FOB, CFR, CIF |
| Payment Terms | L/C, T/T, Western Union |
| Download PDF | Parker Chomerics CHO-BOND 4041 Part B Conductive Adhesive.pdf |
| Price | EMAIL US sales@lookpolymers.com |
| Physical Properties | Metric | English | Comments |
|---|---|---|---|
| Specific Gravity | >= 1.00 g/cc | >= 1.00 g/cc |
| Thermal Properties | Metric | English | Comments |
|---|---|---|---|
| Flash Point | >= 93.3 °C | >= 200 °F |
| Component Elements Properties | Metric | English | Comments |
|---|---|---|---|
| Copper, Cu | >= 75 % | >= 75 % | |
| Silver, Ag | <= 20 % | <= 20 % |
| Descriptive Properties | Value | Comments |
|---|---|---|
| Color | Silver | |
| Physical Form | Silver paste mild odor | |
| Silicone Resin % | <10 |