Parker Chomerics CHO-BOND 1086 Conductive Caulk/Sealant

Category	Polymer , Adhesive , Thermoset
Manufacturer	Parker Chomerics
Trade Name	CHO-BOND
Port	Shanghai port,China
Trade Terms	FOB, CFR, CIF
Payment Terms	L/C, T/T, Western Union
Download PDF	Parker Chomerics CHO-BOND 1086 Conductive Caulk/Sealant.pdf
Price	EMAIL US sales@lookpolymers.com

Material Notes:

Chomerics two-component conductive epoxy caulks provide excellent adhesion to dissimilar substrates and can be used in lap or butt joint applications. They feature large silver-plated-copper particles that make them well suited for sealing poorly toleranced surfaces.Information provided by Chomerics

Physical Properties	Metric	English
Specific Gravity	0.680 - 0.880 g/cc	0.680 - 0.880 g/cc
Volatile Organic Compounds (VOC) Content	740 g/l	740 g/l
Thickness	<= 5.08 microns	<= 0.200 mil

Thermal Properties	Metric	English	Comments
Maximum Service Temperature, Air	200 °C	392 °F
Minimum Service Temperature, Air	-20.0 °C	-4.00 °F

Processing Properties	Metric	English	Comments
Cure Time	30.0 min @Temperature 23.0 °C	0.500 hour @Temperature 73.4 °F
Shelf Life	6.00 Month	6.00 Month

Descriptive Properties	Value	Comments
Binder	Primer
Consistency	Thin Fluid
Mix Ratio	1-part

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