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Park Electrochemical Nelco® N4000-29 Multifunctional Epoxy

Category Polymer , Thermoset , Epoxy
Manufacturer Park Electrochemical Corp.
Trade Name Nelco®
Port Shanghai port,China
Trade Terms FOB, CFR, CIF
Payment Terms L/C, T/T, Western Union
Download PDF Park Electrochemical Nelco® N4000-29 Multifunctional Epoxy.pdf
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Material Notes:
The Nelco N4000-29 is an advanced, lead-free, low-CTE, high Tg (185º C by DSC) multifunctional epoxy dielectric substrate. This material has been designed for use not only in standard multilayer PWB designs, but for today’s toughest, high-performance, lead-free applications.Key Features and Benefits:Low Z-axis expansionHigh Tg, excellent thermal stability and moisture resistanceCAF ResistantProprietary resin chemistrySuperior electrical propertiesOptimized FR-4 processingApplications/Qualifications:Advanced Lead-Free Assembly SubstrateLarge Format BackplanesTight Tolerance Via to Via ApplicationsHigh I / O Count BGA SubstratesExtreme Layer Count MultilayersLead-Free DCA ApplicationsHigh Temperature Underhood AutomotiveTelecommunications InfrastructureSophisticated Data Storage ApplicationsRoHS CompliantMeets IPC-4101/28, /98, /99 and /126 SpecificationsInformation provided by Park Electrochemical Corp.
Physical Properties Metric English Comments
Density 1.99 g/cc
0.0719 lb/in³
50% Resin Content; Internal Method
Water Absorption 0.15 %
0.15 %
IPC-TM-650.2.6.2.1
Mechanical Properties Metric English Comments
Modulus of Elasticity 20.0 GPa
2900 ksi
Y; ASTM D3039
24.8 GPa
3600 ksi
X; ASTM D3039
Poissons Ratio 0.16
0.16
Y; ASTM D3039
0.18
0.18
X; ASTM D3039
Peel Strength 1.56 kN/m
8.90 pli
at elevated temperature; IPC-TM-650.2.4.8.2a
1.70 kN/m
9.70 pli
after exposure to process solutions; IPC-TM-650.2.4.8
1.88 kN/m
10.7 pli
after solder float; IPC-TM-650.2.4.8
Thermal Properties Metric English Comments
CTE, linear 12.0 - 15.0 µm/m-°C

@Temperature -40.0 - 125 °C
6.67 - 8.33 µin/in-°F

@Temperature -40.0 - 257 °F
X/Y; IPC-TM-650.2.4.41
55.1 µm/m-°C

@Temperature 50.0 - 185 °C
30.6 µin/in-°F

@Temperature 122 - 365 °F
Z-Axis Alpha 1; IPC-TM-650.2.4.41
265 µm/m-°C

@Temperature 185 - 260 °C
147 µin/in-°F

@Temperature 365 - 500 °F
Z-Axis Alpha 2; IPC-TM-650.2.4.41
Specific Heat Capacity 0.920 J/g-°C
0.220 BTU/lb-°F
ASTM E1461-92
Thermal Conductivity 0.460 W/m-K
3.19 BTU-in/hr-ft²-°F
ASTM E1461-92
Glass Transition Temp, Tg >= 175 °C
>= 347 °F
TMA; IPC-TM-650.2.4.24c
>= 185 °C
>= 365 °F
DSC; IPC-TM-650.2.4.25c
Decomposition Temperature 350 °C
662 °F
5% weight loss; TGA; IPC-TM-650.2.4.24.6
Flammability, UL94 V-0
V-0
Electrical Properties Metric English Comments
Volume Resistivity 1.00e+13 ohm-cm
1.00e+13 ohm-cm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+14 ohm-cm
1.00e+14 ohm-cm
E - 24/125; IPC-TM-650.2.5.17.1
Surface Resistance 1.00e+12 ohm
1.00e+12 ohm
C - 96/35/90; IPC-TM-650.2.5.17.1
1.00e+13 ohm
1.00e+13 ohm
E - 24/125; IPC-TM-650.2.5.17.1
Dielectric Constant 4.0

@Frequency 1.00e+10 Hz
4.0

@Frequency 1.00e+10 Hz
Stripline; IPC-TM-650.2.5.5.5
4.2

@Frequency 1.00e+10 Hz
4.2

@Frequency 1.00e+10 Hz
Split Post Cavity
4.3

@Frequency 1.00e+9 Hz
4.3

@Frequency 1.00e+9 Hz
RF Impedance; IPC-TM-650.2.5.5.9
4.5

@Frequency 1.00e+6 Hz
4.5

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
Dielectric Strength 43.3 kV/mm
1100 kV/in
IPC-TM-650.2.5.6.2
Dielectric Breakdown >= 50000 V
>= 50000 V
IPC-TM-650.2.5.6
Dissipation Factor 0.015

@Frequency 2.50e+9 Hz
0.015

@Frequency 2.50e+9 Hz
Split Post Cavity
0.016

@Frequency 1.00e+6 Hz
0.016

@Frequency 1.00e+6 Hz
TFC/LCR Meter; IPC-TM-650.2.5.5.3
0.017

@Frequency 1.00e+10 Hz
0.017

@Frequency 1.00e+10 Hz
Split Post Cavity
Arc Resistance 129 sec
129 sec
IPC-TM-650.2.5.1
Descriptive Properties Value Comments
Methylene Chloride Resistance (% Weight Change) 0.01
IPC-TM-650.2.3.4.3
Pressure Cooker Pass
60 min then solder dip @288ºC until failure (max 10 min.); IPC-TM-650.2.6.16 (modified)
T260 (minutes) >60
IPC-TM-650.2.4.24.1
T288 (minutes) 15
IPC-TM-650.2.4.24.1
Z Axis Expansion (%) 3
50ºC to 260ºC; IPC-TM-650.2.4.41
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