Master Bond EP77M-1 Fast Setting, Silver Conductive Epoxy

Description: Master Bond Polymer System EP77M-1 is a two component, silver filled, electrically conductive adhesive for high performance bonding and sealing formulated to cure at room temperature or more rapidly at elevated temperatures. It readily develops a high bonding strength of more than 2000 psi tensile shear when measured and cured at 75°F. It is 100% reactive and does not contain any diluents or solvents. The volume resistivity of the cured system is less than 10-3 ohm-cm. EP77M-1 offers superior dimensional stability. Master Bond Polymer System EP77M-1 can be applied with minimal sagging or dripping even on vertical surfaces although it can be made thinner (flowable) by adding 5 to 10% of an appropriate solvent (xylene, acetone, MEK, etc.) by weight. The high strength bonds are remarkably resistant to chemicals including water, oil and most organic solvents, over the exceptionally wide temperature range of -60 to +300°F. Adhesion to metals, glass, ceramics, vulcanized rubbers and many plastics is excellent. Part A is silver, Part B is a clear liquid. Master Bond EP77M-1 adhesive is widely used in the electronic, electrical, computer, semiconductor, microwave, appliance, and automotive industries, among others. For convenient handling, EP77M-1 is now available in premixed and frozen syringes.Product Advantages: Contains no volatiles; excellent low outgassing properties Easy application: contact pressure only required for cure; adhesive spreads evenly and smoothly Versatile cure schedules: ambient temperature cures or fast elevated temperature cures as required High electrical conductivity High bond strength to similar and dissimilar substrates Superior durability, thermal shock and chemical resistance Good rigidity and dimensional stability. Widely used in military and piezoceramic applications.Information provided by MasterBond®